Fabrication of wafer level chip scale packaging for optoelectronic devices - ORA - Oxford University Research Archive

Back to Search

Conference item

Fabrication of wafer level chip scale packaging for optoelectronic devices

Abstract:: A novel, simple processing and wafer level packaging method for a 4×4 Resonant Cavity LEDs chip with individual array is under development. Palladium/Gold (Pd/Au) alloys are used as p-type contacts and as rewiring metallization for optoelectronic devices to improve the fabrication process. By use of these alloys we have found a reduction of a factor of 10 in the resistance compared to Titanium/Gold (Ti/Au), due to the formation of a conducting oxide at the interface between the metal and semi...
Expand abstract
Collapse abstract

Publication status:: Published

Actions

Email

Email this record

Send the bibliographic details of this record to your email address.

Your Email
Please enter the email address that the record information will be sent to.

-
Your message (optional)
Please add any additional information to be included within the email.
Cite

Cite this record

APA Style

Kim, K., Faulkner, G., O'Brien, D., Edwards, D., Lau, J., & IEEE. (2016). Fabrication of wafer level chip scale packaging for optoelectronic devices. 1145–1147.

MLA Style

Kim, K., et al. Fabrication of Wafer Level Chip Scale Packaging for Optoelectronic Devices. IEEE, 2016, pp. 1145–47.

Chicago Style

Kim, K, G Faulkner, D O'Brien, D Edwards, J Lau, and IEEE. 2016. “Fabrication of Wafer Level Chip Scale Packaging for Optoelectronic Devices.” In , 1145–47. IEEE.
Tweet
Print

Authors

+ Kim, K More by this author

Role:

Author

+ Faulkner, G More by this author

Role:

Author

+ O'Brien, D More by this author

Institution:

University of Oxford

Division:

MPLS

Department:

Engineering Science

Role:

Author

+ Edwards, D More by this author

Institution:

University of Oxford

Division:

MPLS

Department:

Engineering Science

Role:

Author

+ Lau, J More by this author

Role:

Author

Expand authors...

Bibliographic Details

Publisher:: IEEE
Pages:: 1145-1147
Host title:: 49TH ELECTRONIC COMPONENTS and TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS
Publication date:: 1999-01-01
ISSN:: 0569-5503
Source identifiers:: 62774
ISBN:: 0780352319

Item Description

Pubs id:: pubs:62774
UUID:: uuid:39dc876a-669b-4264-9593-fae4bcf7a151
Local pid:: pubs:62774
Deposit date:: 2012-12-19

Terms of use

Copyright date:: 1999

Licence:: Terms and Conditions of Use for Oxford University Research Archive

Metrics

Views and Downloads

About views and downloads

If you are the owner of this record, you can report an update to it here: Report update to this record

TO TOP