Thesis
The processing, microstructure and creep properties of Pb-free solders for harsh environments
- Abstract:
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The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received solder balls and solder joints. Ball Grid Array (BGA) solder joints in a typical electronic configuration were manufactured in-house using both Cu and Pd-Ag metallizations. Microstructural characterisation...
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Funding
+ Engineering and Physical Sciences Research Council
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Funding agency for:
Godard Desmarest, S
Bibliographic Details
- Publication date:
- 2013
- Type of award:
- DPhil
- Level of award:
- Doctoral
- Awarding institution:
- Oxford University, UK
Item Description
- Language:
- English
- Keywords:
- Subjects:
- UUID:
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uuid:c9f90f13-fcc3-4bb4-8a2c-b980aacb89c9
- Local pid:
- ora:7940
- Deposit date:
- 2014-02-03
Terms of use
- Copyright holder:
- Godard Desmarest, S
- Copyright date:
- 2013
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